1. Basis brasses: oxygen-free copper

2. Basis brasses electrical resistivity: oxygen-free copper wire≤0.0165Ωmm²/m

3．Solder tin component：（1）63%Sn 37%b    （2）60%Sn 40%Pb  

（3）99%Sn 1%Ag     (4) 96.5%Sn 3.5%Ag

(5) 62%Sn 36%Pb 2%Ag

4．Solder tin melting point： 179—224℃

5．Tin thickness： One-side coated≥0.02mm

6．Extensibility： Soft phase≥25%，semi-soft phase≥15%

7．Width error：±0.05mm  Thickness error：±0.01mm

7．Packing：paper disk, ABS cylinder, paper box for cut off